SN74ABTH16245 - 16-Bit Bus Transceivers With 3-State Outputs

The 'ABTH16245 devices are 16-bit noninverting 3-state transceivers that provide synchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.

These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE\) input can be used to disable the devices so that the buses are effectively isolated.

When V_CC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN54ABTH16245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABTH16245 is characterized for operation from -40°C to 85°C.

Products containing the "SN74ABTH16245" keyword are: SN74ABTH16245DGGR , SN74ABTH16245DGGR , SN74ABTH16245DGGRG4 , SN74ABTH16245DGVR , SN74ABTH16245DGVR , SN74ABTH16245DL , SN74ABTH16245DL , SN74ABTH16245DLG4 , SN74ABTH16245DLG4 , SN74ABTH16245DLR , SN74ABTH16245DLR

• Members of the Texas Instruments Widebus^TM Family
• State-of-the-Art EPIC-II B^TM BiCMOS Design Significantly Reduces Power Dissipation
• Typical V_OLP (Output Ground Bounce) < 1 V at V_CC = 5 V, T_A = 25°C
• High-Impedance State During Power Up and Power Down
• Distributed V_CC and GND Pin Configuration Minimizes High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• High-Drive Outputs (-32-mA I_OH, 64-mA I_OL)
• Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
• Latch-Up Performance Exceeds 500 mA Per JESD 17
• Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

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