SN74ABTR2245 - Octal Transceivers And Line/Memory Drivers With 3-State Outputs

Updated : 2020-01-09 14:36:23
Description

These octal transceivers and line drivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE\) input can be used to disable the device so the buses are effectively isolated.

Both the A-port and B-port outputs, which are designed to sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABTR2245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABTR2245 is characterized for operation from -40°C to 85°C.

Products containing the "SN74ABTR2245" keyword are: SN74ABTR2245DBR , SN74ABTR2245DBR , SN74ABTR2245DBRE4 , SN74ABTR2245DBRE4 , SN74ABTR2245DBRG4 , SN74ABTR2245DBRG4 , SN74ABTR2245DGVR , SN74ABTR2245DW , SN74ABTR2245DW , SN74ABTR2245DWR , SN74ABTR2245DWR , SN74ABTR2245NSRG4 , SN74ABTR2245PWE4 , SN74ABTR2245PWG4 , SN74ABTR2245PWR , SN74ABTR2245PWR
Features

  • Outputs Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • High-Impedance State During Power Up and Power Down
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • ESD Protection Exceeds 2000 V Per MIL-STD-833, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Thin Very Small-Outline (DGV) Packages, Ceramic Chip Carriers (FK), and Plastic (N) and Ceramic (J) DIPs

    EPIC-IIB is a trademark of Texas Instruments Incorporated.