SN74LVTZ244 - 3.3-V ABT Octal Buffers/Drivers With 3-State Outputs

Updated : 2020-01-09 14:35:40
Description

These octal buffers/drivers are designed specifically for low-voltage (3.3-V) VCC operation with the capability to provide a TTL interface to a 5-V system environment.

These devices are organized as two 4-bit line drivers with separate output-enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74LVTZ244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVTZ244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVTZ244 is characterized for operation from -40°C to 85°C.

 

 

Products containing the "SN74LVTZ244" keyword are: SN74LVTZ244DBR , SN74LVTZ244DBR , SN74LVTZ244DBRG4 , SN74LVTZ244DW , SN74LVTZ244DW , SN74LVTZ244DWR , SN74LVTZ244DWR , SN74LVTZ244PWLE , SN74LVTZ244PWR , SN74LVTZ244PWR
Features

  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
  • High-Impedance State During Power Up and Power Down
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) DIPs