SN74LVC541A-EP - Enhanced Product Octal Buffer/Driver With 3-State Outputs

The SN74LVC541A-EP octal buffer/driver is designed for 2.7-V to 3.6-V V_CC operation.

The device is ideal for driving bus lines or buffering memory address registers.

This device features inputs and outputs on opposite sides of the package to facilitate printed circuit board layout.

The 3-state control gate is a 2-input AND gate with active-low inputs so that, if either output enable (OE1\ or OE2\) input is high, all eight outputs are in the high-impedance state.

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

• Controlled Baseline
  • One Assembly/Test Site, One Fabrication Site
• Extended Temperature Performance of –40°C to 125°C
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree
• Operates From 2 V to 3.6 V
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 5.1 ns at 3.3 V
• Typical V_OLP (Output Ground Bounce)
     <0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
     >2 V at V_CC = 3.3 V, T_A = 25°C
• Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V V_CC)
• I_off Supports Partial-Power-Down Mode Operation

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.