SN74ACT16373-EP - Enhanced Product 16-Bit D-Type Transparent Latch With 3-State Outputs

Updated : 2020-01-09 14:33:32
Description

The SN74ACT16373Q-EP is a 16-bit D-type transparent latch with 3-state outputs, designed specifically for driving highly capacitive or relatively low-impedance loads. It is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

This device can be used as two 8-bit latches or one 16-bit latch. The Q outputs of the latches follow the data (D) inputs if the latch-enable (LE) input is taken high. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs.

A buffered output-enable (OE)\ input can be used to place the outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines in a bus-organized system, without need for interface or pullup components.

OE\ does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

Features

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • Member of the Texas Instruments Widebus™ Family
  • Inputs Are TTL-Voltage Compatible
  • 3-State Bus Driving True Outputs
  • Full Parallel Access for Loading
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise

Widebus is a trademark of Texas Instruments.
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, highly accelerated stress test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life.