SN74ABT16541A - 16-Bit Buffers/Drivers With 3-State Outputs

The SN54ABT16541 and SN74ABT16541A are noninverting 16-bit buffers composed of two 8-bit sections with separate output-enable signals. For either 8-bit buffer section, the two output-enable (1 and 1 or 2and 2) inputs must both be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 8-bit buffer section are in the high-impedance state.

To ensure the high-impedance state during power up or power down, should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT16541 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16541A is characterized for operation from -40°C to 85°C.

 

 

Products containing the "SN74ABT16541A" keyword are: SN74ABT16541ADGGR , SN74ABT16541ADGGR , SN74ABT16541ADGGRG4 , SN74ABT16541ADGVR , SN74ABT16541ADGVR , SN74ABT16541ADL , SN74ABT16541ADL , SN74ABT16541ADLG4 , SN74ABT16541ADLG4 , SN74ABT16541ADLR , SN74ABT16541ADLR , SN74ABT16541ADLRG4 , SN74ABT16541ADLRG4

• Members of the Texas Instruments Widebus^TM Family
• State-of-the-Art EPIC-IIB^TM BiCMOS Design Significantly Reduces Power Dissipation
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical V_OLP (Output Ground Bounce) < 0.8 V at V_CC = 5 V, T_A = 25°C
• Distributed V_CC and GND Pin Configuration Minimizes High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• High-Drive Outputs (-32-mA I_OH, 64-mA I_OL)
• Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Spacings

 

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