SN74ABT2240A - Octal Buffers And Line/MOS Drivers With 3-State Outputs

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the 'ABT2241 and 'ABT2244A, these devices provide combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE\) inputs, and complementary OE and OE\ inputs. These devices feature high fan-out and improved fan-in.

These devices are organized as two 4-bit line drivers with separate OE\ inputs. When OE\ is low, the devices pass inverted data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.

The outputs, which are designed to sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT2240A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT2240A is characterized for operation from -40°C to 85°C.

Products containing the "SN74ABT2240A" keyword are: SN74ABT2240ADBR , SN74ABT2240ADBR , SN74ABT2240ADBR AA240A , SN74ABT2240ADW , SN74ABT2240ADW , SN74ABT2240ADWR , SN74ABT2240ADWR , SN74ABT2240AN , SN74ABT2240AN , SN74ABT2240ANSR , SN74ABT2240ANSR , SN74ABT2240APW , SN74ABT2240APW , SN74ABT2240APWG4 , SN74ABT2240APWLE , SN74ABT2240APWR , SN74ABT2240APWR

• Output Ports Have Equivalent 25- Series Resistors, So No External Resistors Are Required
• State-of-the-Art EPIC-II B^TM BiCMOS Design Significantly Reduces Power Dissipation
• Typical V_OLP (Output Ground Bounce) < 1 V at V_CC = 5 V, T_A = 25°C
• Latch-Up Performance Exceeds 500 mA
  Per JESD 17
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

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