SN74ABT244A - Octal Buffers/Drivers With 3-State Outputs

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the SN54ABT240, SN74ABT240A, SN54ABT241, and SN74ABT241A, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE)\ inputs, and complementary OE and OE\ inputs.

The SN54ABT244 and SN74ABT244A are organized as two 4-bit buffers/line drivers with separate OE\ inputs. When OE\ is low, the devices pass noninverted data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT244A is characterized for operation from -40°C to 85°C.

Products containing the "SN74ABT244A" keyword are: SN74ABT244ADB , SN74ABT244ADB , SN74ABT244ADBE4 , SN74ABT244ADBG4 , SN74ABT244ADBLE , SN74ABT244ADBR , SN74ABT244ADBR AB244A , SN74ABT244ADBRG4 , SN74ABT244ADBRG4 , SN74ABT244ADW , SN74ABT244ADW , SN74ABT244ADWE4 , SN74ABT244ADWE4 , SN74ABT244ADWG4 , SN74ABT244ADWR , SN74ABT244ADWR , SN74ABT244ADWR SOP7.2 , SN74ABT244ADWRE4 , SN74ABT244ADWRG4 , SN74ABT244ADWRG4

• State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Typical V_OLP (Output Ground Bounce) < 1 V at V_CC = 5 V, T_A = 25°C
• High-Drive Outputs (-32-mA I_OH, 64-mA I_OL)
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

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