SN74ABT543A - Octal Registered Transceivers With 3-State Outputs

The 'ABT543A octal transceivers contain two sets of D-type latches for temporary storage of data flowing in either direction. Separate latch-enable (LEAB\ or LEBA\) and output-enable (OEAB\ or OEBA\) inputs are provided for each register to permit independent control in either direction of data flow.

The A-to-B enable (CEAB\) input must be low to enter data from A or to output data from B. If CEAB\ is low and LEAB\ is low, the A-to-B latches are transparent; a subsequent low-to-high transition of LEAB\ puts the A latches in the storage mode. With CEAB\ and OEAB\ both low, the 3-state B outputs are active and reflect the data present at the output of the A latches. Data flow from B to A is similar, but requires using the CEBA\, LEBA\, and OEBA\ inputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT543A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT543A is characterized for operation from -40°C to 85°C.

Products containing the "SN74ABT543A" keyword are: SN74ABT543ADB , SN74ABT543ADBE4 , SN74ABT543ADBLE , SN74ABT543ADBR , SN74ABT543ADBR , SN74ABT543ADBR AB543A , SN74ABT543ADBRG4 , SN74ABT543ADBRG4 , SN74ABT543ADW , SN74ABT543ADW , SN74ABT543ADWG4 , SN74ABT543ADWR , SN74ABT543ADWR , SN74ABT543ADWR. , SN74ABT543ADWRE4 , SN74ABT543ANSR , SN74ABT543ANSRE4 , SN74ABT543ANSRG4 , SN74ABT543ANSRG4 , SN74ABT543ANT

• State-of-the-Art EPIC-II B^TM BiCMOS Design Significantly Reduces Power Dissipation
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Typical V_OLP (Output Ground Bounce) < 1 V at V_CC = 5 V, T_A = 25°C
• High-Drive Outputs (-32-mA I_OH, 64-mA I_OL)
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (NT) and Ceramic (JT) DIPs

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