SN74ALVTH16601 - 2.5-V/3.3-V 18-Bit Universal Bus Transceiver With 3-State Outputs

The 'ALVTH16601 devices are 18-bit universal bus transceivers designed for 2.5-V or 3.3-V V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The devices combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes.

Data flow in each direction is controlled by output-enable (OEAB\ and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. The clock can be controlled by the clock-enable (CLKENAB\ and CLKENBA\) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. Output enable OEAB\ is active low. When OEAB\ is low, the outputs are active. When OEAB\ is high, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B, but uses OEBA\, LEBA, CLKBA, and CLKENBA\.

This device is fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

When V_CC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN54ALVTH16601 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16601 is characterized for operation from -40°C to 85°C.

Products containing the "SN74ALVTH16601" keyword are: SN74ALVTH16601DL , SN74ALVTH16601DL , SN74ALVTH16601DLR , SN74ALVTH16601DLR , SN74ALVTH16601GR , SN74ALVTH16601GR , SN74ALVTH16601GRG4 , SN74ALVTH16601VR , SN74ALVTH16601VR , SN74ALVTH16601VRG4

• UBT^TM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, Clocked, or Clock-Enabled Mode
• State-of-the-Art Advanced BiCMOS Technology (ABT) Widebus^TM Design for 2.5-V and 3.3-V Operation and Low Static-Power Dissipation
• Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V V_CC)
• Typical V_OLP (Output Ground Bounce) <0.8 V at V_CC = 3.3 V, T_A = 25°C
• High-Drive (-24/24 mA at 2.5-V and
  -32/64 mA at 3.3-V V_CC)
• I_off and Power-Up 3-State Support Hot Insertion
• Use Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
• Auto3-State Eliminates Bus Current Loading When Output Exceeds V_CC + 0.5 V
• Flow-Through Architecture Facilitates Printed Circuit Board Layout
• Distributed V_CC and GND Pin Configuration Minimizes High-Speed Switching Noise
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

NOTE: For tape and reel order entry:
The DGGR package is abbreviated to GR and
the DGVR package is abbreviated to VR.
UBT and Widebus are trademarks of Texas Instruments Incorporated.