SN74ABT16500B - 18-Bit Universal Bus Transceivers With 3-State Outputs

These 18-bit universal bus transceivers combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes.

Data flow in each direction is controlled by output-enable (OEAB and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB\ and CLKBA\) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB\ is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the high-to-low transition of CLKAB\. OEAB is active-high. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B but uses OEBA\, LEBA, and CLKBA\. The output enables are complementary (OEAB is active high and OEBA\ is active low).

When V_CC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to V_CC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

The SN54ABT16500B is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16500B is characterized for operation from -40°C to 85°C.

Products containing the "SN74ABT16500B" keyword are: SN74ABT16500BDGGR , SN74ABT16500BDL , SN74ABT16500BDL , SN74ABT16500BDLG4 , SN74ABT16500BDLG4 , SN74ABT16500BDLR , SN74ABT16500BDLR , SN74ABT16500BDLR10 , SN74ABT16500BDLRG4

• Members of the Texas Instruments Widebus^TM Family
• State-of-the-Art EPIC-II B^TM BiCMOS Design Significantly Reduces Power Dissipation
• UBT^TM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical V_OLP (Output Ground Bounce) < 0.8 V at V_CC = 5 V, T_A = 25°C
• High-Impedance State During Power Up and Power Down
• Flow-Through Architecture Optimizes PCB Layout
• Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus, EPIC-IIB, and UBT are trademarks of Texas Instruments Incorporated.