SN74LVT16240 - 3.3-V ABT 16-Bit Buffers/Drivers With 3-State Outputs

The 'LVT16240 devices are 16-bit buffers and line drivers designed specifically for low-voltage (3.3-V) V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide inverting outputs and symmetrical active-low output-enable (OE) inputs.

When V_CC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54LVT16240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT16240 is characterized for operation from -40°C to 85°C.

Products containing the "SN74LVT16240" keyword are: SN74LVT16240DGGR , SN74LVT16240DL , SN74LVT16240DL , SN74LVT16240DLR , SN74LVT16240DLR , SN74LVT16240DLRG4

• Members of the Texas Instruments Widebus™ Family
• State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
• Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V V_CC)
• Support Unregulated Battery Operation Down to 2.7 V
• Typical V_OLP (Output Ground Bounce) <0.8 V at V_CC = 3.3 V, T_A = 25°C
• I_off and Power-Up 3-State Support Hot Insertion
• Distributed V_CC and GND Pins Minimize High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)
• Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

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