SN74LV244A-EP - Enhanced Product Octal Buffers/Drivers With 3-State Outputs

This octal buffer/line driver is designed for 2-V to 5.5-V V_CC operation.

The SN74LV244A-EP is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The device is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down.

• Controlled Baseline
  • One Assembly/Test Site, One Fabrication Site
• Extended Temperature Performance of -55°C to 125°C
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree⁽¹⁾
• 2-V to 5.5-V V_CC Operation
• Max t_pd of 6.5 ns at 5 V
• Typical V_OLP (Output Ground Bounce) <0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot) >2.3 V at V_CC = 3.3 V, T_A = 25°C
• Supports Mixed-Mode Voltage Operation on All Ports
• I_off Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 250 mA Per JESD 17
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

⁽¹⁾Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.