SN74F244 - Octal Buffers/Drivers With 3-State Outputs

Updated : 2020-01-09 14:35:21
Description

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ´F240 and ´F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (active-low output-enable) inputs, and complementary OE and inputs.

The ´F244 is organized as two 4-bit buffers/line drivers with separate output enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The SN74F244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F244 is characterized for operation from 0°C to 70°C.

 

 

Products containing the "SN74F244" keyword are: SN74F244DB , SN74F244DB , SN74F244DBLE , SN74F244DBR , SN74F244DBR , SN74F244DBRG4 , SN74F244DW , SN74F244DW , SN74F244DWG4 , SN74F244DWG4 , SN74F244DWR , SN74F244DWR , SN74F244DWRG4 , SN74F244DWRG4 , SN74F244N , SN74F244N , SN74F244N DIP , SN74F244NE4 , SN74F244NE4 , SN74F244NG4
Features

  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs