The SN74LVC1G11 performs the Boolean function Y = A • B • C or Y = A\ + B\ + C\ in positive logic.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
(1) Additional temperature ranges are available - contact factory
NanoFree Is a trademark of Texas Instruments.
| Status | ACTIVE |
| SubFamily | AND gate |
| Technology Family | LVC |
| VCC | 5.5 |
| Channels | 1 |
| Inputs per channel | 3 |
| ICC @ nom voltage | 0.01 |
| IOL | 32 |
| IOH | -32 |
| Input type | Standard CMOS |
| Output type | Push-Pull |
| Features | Partial Power Down (Ioff)^Over-Voltage Tolerant Inputs^Ultra High Speed (tpd <5ns) |
| Data rate | 100 |
| Rating | HiRel Enhanced Product |
| Operating temperature range | -55 to 125 |
| Package Group | SC70|6 |
| Package size: mm2:W x L (PKG) | [pf]6SC70[/pf]: 4 mm2: 2.1 x 2 (SC70|6) |
| Approx. price | 0.39 | 1ku |