The SN74LVC1G11 performs the Boolean function Y = A • B • C or Y = A\ + B\ + C\ in positive logic.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
(1) Additional temperature ranges are available - contact factory
NanoFree Is a trademark of Texas Instruments.
Status | ACTIVE |
SubFamily | AND gate |
Technology Family | LVC |
VCC | 5.5 |
Channels | 1 |
Inputs per channel | 3 |
ICC @ nom voltage | 0.01 |
IOL | 32 |
IOH | -32 |
Input type | Standard CMOS |
Output type | Push-Pull |
Features | Partial Power Down (Ioff)^Over-Voltage Tolerant Inputs^Ultra High Speed (tpd <5ns) |
Data rate | 100 |
Rating | HiRel Enhanced Product |
Operating temperature range | -55 to 125 |
Package Group | SC70|6 |
Package size: mm2:W x L (PKG) | [pf]6SC70[/pf]: 4 mm2: 2.1 x 2 (SC70|6) |
Approx. price | 0.39 | 1ku |