The SN74LVC1G10 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Products containing the "SN74LVC1G10" keyword are: SN74LVC1G10DBVR , SN74LVC1G10DBVR , SN74LVC1G10DBVRE4 , SN74LVC1G10DBVRG4 , SN74LVC1G10DCKR , SN74LVC1G10DCKR , SN74LVC1G10DCKRG4 , SN74LVC1G10DCKRG4 , SN74LVC1G10DRYR , SN74LVC1G10DRYR , SN74LVC1G10DSFR , SN74LVC1G10DSFR , SN74LVC1G10YZPR , SN74LVC1G10YZPR , SN74LVC1G10YZPR , S947T| Status | ACTIVE |
| SubFamily | NAND gate |
| Technology Family | LVC |
| VCC | 5.5 |
| Channels | 1 |
| Inputs per channel | 3 |
| ICC @ nom voltage | 0.01 |
| IOL | 32 |
| IOH | -32 |
| Input type | Standard CMOS |
| Output type | Push-Pull |
| Features | Partial Power Down (Ioff)^Over-Voltage Tolerant Inputs^Ultra High Speed (tpd <5ns) |
| Data rate | 100 |
| Rating | Catalog |
| Operating temperature range | -40 to 125 |
| Package Group | DSBGA|6 |
| Package size: mm2:W x L (PKG) | See datasheet (DSBGA) |
| Approx. price | 0.07 | 1ku |