SN74ABT16245A - 16-Bit Bus Transceivers With 3-State Outputs

The 'ABT16245A devices are 16-bit noninverting 3-state transceivers designed for synchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements.

These devices can be used as two 8-bit transceviers or one 16-bit transceiver. They allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated.

When V_CC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impendance state above 2.1 V, OE should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT16245A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16245A is characterized for operation from -40°C to 85°C.

Products containing the "SN74ABT16245A" keyword are: SN74ABT16245ADGGR , SN74ABT16245ADGGR , SN74ABT16245ADGGR/SN74AB , SN74ABT16245ADGGRG4 , SN74ABT16245ADGVR , SN74ABT16245ADGVR , SN74ABT16245ADGVRE4 , SN74ABT16245ADL , SN74ABT16245ADLG4 , SN74ABT16245ADLR , SN74ABT16245ADLR , SN74ABT16245ADLR SSOP48 , SN74ABT16245ADLR//SN74AB , SN74ABT16245ADLRG4 , SN74ABT16245ADLRG4

• Members of the Texas Instruments Widebus™ Family
• State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation
• Typical V_OLP (Output Ground Bounce) < 1 V at V_CC = 5 V, T_A = 25°C
• High-Impedance State During Power Up and Power Down
• Distributed V_CC and GND Pin Configuration Minimizes High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• High-Drive Outputs (-32-mA I_OH, 64-mA I_OL)
• Latch-Up Performance Exceeds 500 mA Per JESD 70
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Package Options Includes Plastic Thin Very Small-Outline (DGV), Shrink Small-Outline (DL), and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic (WD) Flat Package Using 25-mil Center-to-Center Spacings

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