SN74AUP1G17-EP - Enhanced Product Low-Power Single Schmitt-Trigger Buffer

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire V_CC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity.

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching noise immunity at the input.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

• Controlled Baseline
  • One Assembly/Test Site, One Fabrication Site
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree⁽¹⁾
• Available in the Texas Instruments NanoStar™ and NanoFree™ Packages
• Low Static-Power Consumption (I_CC = 0.9 µA Max)
• Low Dynamic-Power Consumption (C_pd = 4.4 pF Typ at 3.3 V)
• Low Input Capacitance (C_I = 1.5 pF)
• Low Noise — Overshoot and Undershoot <10% of V_CC
• I_off Supports Partial-Power-Down Mode Operation
• Includes Schmitt-Trigger Inputs
• Wide Operating V_CC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• t_pd = 5.1 ns Max at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
  • 2000-V Human-Body Model (A114-B, Class II)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)
• ESD Protection Exceeds 5000 V With Human-Body Model

⁽¹⁾ Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

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