74AC16244 - 16-Bit Buffers And Line Drivers With 3-State Outputs

The 'AC16244 are 16-bit buffers/line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical active-low output-enable inputs. When is low, the device passes noninverted data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The 74AC16244 is packaged in the TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16244 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16244 is characterized for operation from -40°C to 85°C.

 

 

Products containing the "74AC16244" keyword are: 74AC16244DGGR , 74AC16244DGGR , 74AC16244DGGRE4 , 74AC16244DGGRG4 , 74AC16244DGGRG4 , 74AC16244DL , 74AC16244DL , 74AC16244DLG4 , 74AC16244DLG4 , 74AC16244DLR , 74AC16244DLR , 74AC16244DLRG4 , 74AC16244SSC , 74AC16244SSC , 74AC16244SSCX , 74AC16244SSCX , 74AC16244TTR

• Members of the Texas Instruments Widebus^TM Family
• 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
• Flow-Through Architecture Optimizes PCB Layout
• Distributed V_CC and GND Configuration Minimizes High-Speed Switching Noise
• EPIC ^TM (Enhanced-Performance Implanted CMOS) 1-m Process
• 500-mA Typical Latch-Up Immunity at 125°C
• Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages Using 25-mil Center-to-Center Pin Spacings, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.