SN74BCT652 - Octal Bus Transceivers And Registers

Updated : 2020-01-09 14:36:33
Description

These devices consist of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers.

Output-enable (OEAB and ) inputs are provided to control the transceiver functions. Select-control (SAB and SBA) inputs are provided to select whether real-time or stored data is transferred. The circuitry used for select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition between stored and real-time data. A low input selects real-time data, and a high input selects stored data. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the ´BCT652.

Data on the A or B data bus, or both, can be stored in the internal D-type flip-flops by low-to-high transitions at the appropriate clock (CLKAB or CLKBA) inputs regardless of the select- or enable-control pins. When SAB and SBA are in the real-time transfer mode, it is possible to store data without using the internal D-type flip-flops by simultaneously enabling OEAB and . In this configuration each output reinforces its input. Therefore, when all other data sources to the two sets of bus lines are at high impedance, each set of bus lines remain at its last state.

The SN54BCT652 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT652 is characterized for operation from 0°C to 70°C.

Products containing the "SN74BCT652" keyword are: SN74BCT652DW , SN74BCT652DW , SN74BCT652DWR , SN74BCT652NT , SN74BCT652NT
Features

  • State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Independent Registers and Enables for A and B Buses
  • Multiplexed Real-Time and Stored Data
  • Power-Up High-Impedance Mode
  • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT)