TLV2462A-EP - Enhanced Product Low-Power Rail-To-Rail Input/Output Operational Amplifier With Shutdown

The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for portable applications. The input common-mode voltage range extends beyond the supply rails for maximum dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters.

The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/µs of slew rate with only 500 µA of supply current, providing good ac performance with low power consumption. Devices are available with an optional shutdown terminal, which places the amplifier in an ultralow supply current mode (I_DD = 0.3 µA/ch). While in shutdown, the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with an input noise voltage of 11 nV/Hz and input offset voltage of 100 µV.

• Controlled Baseline
  • One Assembly/Test Site, One Fabrication Site
• Extended Temperature Performance of –55°C to 125°C
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product Change Notification
• Qualification Pedigree
• Rail-to-Rail Output Swing
• Gain Bandwidth Product . . . 6.4 MHz
• ±80 mA Output Drive Capability
• Supply Current . . . 500 µA/channel
• Input Offset Voltage . . . 100 µV
• Input Noise Voltage ...11 nV/Hz
• Slew Rate . . . 1.6 V/µs
• Micropower Shutdown Mode (TLV2460/3) . . . 0.3 µA/Channel
• Universal Operational Amplifier EVM

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.